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Emerging Opportunities for Photonic Integrated Circuits
Emerging Opportunities for Photonic Integrated Circuits
High competitive intensity due to growing adoption in high-speed communication, optical sensing, and imaging
07-Nov-2022
Global
Description
A photonic integrated circuit (PIC) is an optical chip that accommodates multiple photonic functions. PIC will address gaps in electrical integrated circuits (EICs), primarily those used in data communication. The capability of PICs to transmit data in an optical medium makes them an effective tool for communication in telecom and data center sectors. In sensors, light is an effective medium for material detection, so PICs are effective in sensing applications as well.
Research and development (R&D) effort to improve the performance parameters of PICs and to determine new materials (III-V materials) is an ongoing process. The steady influx of investment, various government initiatives, and the efforts of global consortiums support PIC-related R&D.
Participants in end-user industries, such as telecom, automotive, and healthcare, are increasingly investing in PICs, as they enable emerging technologies, such as 5G, autonomous vehicles, augmented reality/virtual reality, and advanced medical imaging. The laser-based communication in space sector is another major area of interest for PICs.
RESEARCH: INFOGRAPHIC
This infographic presents a brief overview of the research, and highlights the key topics discussed in it.Click image to view it in full size
Table of Contents
Why Is It Increasingly Difficult to Grow?The Strategic Imperative 8™: Factors Creating Pressure on Growth
The Strategic Imperative 8™
The Impact of the Top 3 Strategic Imperatives of the Photonic Integrated-circuit Industry
Growth Opportunities Fuel the Growth Pipeline Engine™
Research Methodology
Key Findings
Scope of Analysis
Segmentation of Industries Impacted by PICs
Growth Drivers
Growth Restraints
PIC Technology Snapshot
Advantages of PICs
PIC Architecture
Optical Components in PICs
PIC Manufacturing Segments
Innovation in PIC Manufacturing
Trends Driving PIC Adoption
Optically Compatible Materials
PIC Fabrication and Optical Processor Research
Increase in Cloud Computing and Sustained R&D
Government Initiatives, US & Canada
Government Initiatives, Europe & APAC
Investments in New Product Development
Investments in PIC Fabrication and Product Commercialization
Strategic Partnerships in PIC Fabrication and Packaging
Strategic Partnerships in PIC Fabrication and Packaging (continued)
Global Consortiums Driving Technical Advancements in PICs Through Funding and Infrastructure Support
End Markets Driving the Demand for PICs
Precision Navigation and Data Communication
Medical Imaging and Missile Guidance
Food Yield Optimization and Space Communication
Industry Prioritization Matrix for PICs
PIC Innovation Disrupting Sensing and Communication-based Applications
PIC Innovation Disrupting the Automotive and Healthcare Sectors
Implementation Case 1: Ella Link, Ireland; Infinera Corporation, US
Implementation Case 1: AutoX Inc., China; SiLC Technologies, Inc., US
Technology Roadmap
Focus on Enabling High-speed Optical Communication
Focus on Fabrication, Packaging, and PIC Application
Ayar Labs, US
Salience Labs, UK
EFFECT Photonics, the Netherlands
LIGENTEC, Switzerland
NEON Photonics, South Korea
Growth Opportunity 1: Supply Chain Ecosystem Consolidation
Growth Opportunity 1: Supply Chain Ecosystem Consolidation (continued)
Growth Opportunity 2: Navigation and Infotainment
Growth Opportunity 2: Navigation and Infotainment (continued)
Growth Opportunity 3: Biophotonic Medical Devices and Sensors
Growth Opportunity 3: Biophotonic Medical Devices and Sensors (continued)
Key Contacts
Technology Readiness Levels (TRL): Explanation
Your Next Steps
Why Frost, Why Now?
Legal Disclaimer
| Author | Sushrutha Katta Sadashiva |
|---|---|
| Industries | Electronics and Sensors |
| No Index | No |
| Is Prebook | No |
| Keyword 1 | photonic integrated circuit |
| Keyword 2 | PICs |
| Keyword 3 | Emerging Industries |
| Podcast | No |
| WIP Number | DA47-01-00-00-00 |