Analysis of the European 3-D IC Market

Gearing up to Take its Place in the Global Semiconductor Ecosystem

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European companies represent about 13.0% of the world semiconductor production and have been a major importer of electronic components. The key focus in Europe so far has been the automotive sector. This research service provides an in-depth analysis of the European 3D IC market. The study covers the 3D packaging and TSV (Through Silicon Via) segments. The study discusses the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. Apart from this, the study also discusses the revenue forecast analysis from 2009 to 2019 for the European market.

Table of Contents

Executive SummaryExecutive SummaryExecutive Summary—Market Engineering MeasurementsExecutive Summary—Market Engineering Measurements (continued)Executive Summary—CEO’s PerspectiveMarket OverviewMarket Overview—DefinitionsMarket Overview—Definitions (continued)Market Overview—Definitions (continued)Market Overview—Definitions (continued)Market Definition—ScopeMarket Overview—Key Questions this Study will AnswerMarket Overview—Distribution ChannelsExternal Challenges: Drivers and Restraints—3-D IC MarketDrivers and RestraintsDrivers ExplainedDrivers Explained (continued)Restraints ExplainedRestraints Explained (continued)Forecast and Trends—3-D IC MarketMarket Engineering MeasurementsMarket Engineering Measurements (continued)Forecast Assumptions3-D IC Market—Revenue ForecastRevenue Forecast Discussion3-D Packaging Segment—Revenue Forecast3-D TSV Segment—Revenue ForecastRevenue Forecast DiscussionThe Last WordThe Last Word—Three Big PredictionsLegal DisclaimerAppendixMarket Engineering MethodologyLearn More—Next Steps

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