Analysis of the European 3-D IC Market

Analysis of the European 3-D IC Market

Gearing up to Take its Place in the Global Semiconductor Ecosystem

RELEASE DATE
13-May-2013
REGION
Europe
Research Code: 4I72-01-00-00-00
SKU: ES00022-EU-MR_02407

$4,950.00

Special Price $3,712.50 save 25 %

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ES00022-EU-MR_02407

$4,950.00

$3,712.50 save 25 %

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Description

European companies represent about 13.0% of the world semiconductor production and have been a major importer of electronic components. The key focus in Europe so far has been the automotive sector. This research service provides an in-depth analysis of the European 3D IC market. The study covers the 3D packaging and TSV (Through Silicon Via) segments. The study discusses the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. Apart from this, the study also discusses the revenue forecast analysis from 2009 to 2019 for the European market.

Table of Contents

Executive Summary

Executive Summary—Market Engineering Measurements

Executive Summary—Market Engineering Measurements (continued)

Executive Summary—CEO’s Perspective

Market Overview—Definitions

Market Overview—Definitions (continued)

Market Overview—Definitions (continued)

Market Overview—Definitions (continued)

Market Definition—Scope

Market Overview—Key Questions this Study will Answer

Market Overview—Distribution Channels

Drivers and Restraints

Drivers Explained

Drivers Explained (continued)

Restraints Explained

Restraints Explained (continued)

Market Engineering Measurements

Market Engineering Measurements (continued)

Forecast Assumptions

3-D IC Market—Revenue Forecast

Revenue Forecast Discussion

3-D Packaging Segment—Revenue Forecast

3-D TSV Segment—Revenue Forecast

Revenue Forecast Discussion

The Last Word—Three Big Predictions

Legal Disclaimer

Market Engineering Methodology

Learn More—Next Steps

Related Research
European companies represent about 13.0% of the world semiconductor production and have been a major importer of electronic components. The key focus in Europe so far has been the automotive sector. This research service provides an in-depth analysis of the European 3D IC market. The study covers the 3D packaging and TSV (Through Silicon Via) segments. The study discusses the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. Apart from this, the study also discusses the revenue forecast analysis from 2009 to 2019 for the European market.
More Information
No Index Yes
Podcast No
Author Priya Venkatraman
Industries Electronics and Sensors
WIP Number 4I72-01-00-00-00
Is Prebook No