Advances in Materials for Electronic Packaging (Technical Insights)
Advances in Materials for Electronic Packaging (Technical Insights)
RELEASE DATE
30-Sep-2008
30-Sep-2008
REGION
Global
Global
Research Code: D139-01-00-00-00
SKU: CM01141-GL-TR_17941
$4,950.00
In stock
SKU
CM01141-GL-TR_17941
Description
This research service profiles important emerging developments and trends related to materials for electronic packaging.
Table of Contents
Scope and Methodology
- Scope
- Methodology
Key Research Findings
- Description of Key Drivers and Challenges
- Research Highlights
Materials Application--Part I
Material Application--Part II
- Overview
- Materials for High-Frequency Applications
- Soldering Materials
- Through Silicon Vias
- Electrically Conductive Adhesives
Wirebonding
- Substrate Materials
- Low and Ultralow-k Materials
Flip Chip Technology--C4 (Controlled Collapse Chip Connection)
- Overview
- Challenge Associated with Tin Whiskers
Thermal Managment Materials
- Overview
- Flip Chip Bumps
- Flip Chip CNTs Bumps
- Under Bump Metallization
- Underfill
- Molding Materials
Industry Analysis
Supply Chain Analysis
Flame Retardant Materials
European Union Regulations
Other Regulations and Impact of Eco-Labeling
Corporations
Universities and Research Centers
Noteworthy Patents; Patents Analysis; and Glossary
Database of Key Partners
Reference Database Tables
Popular Topics
This research service profiles important emerging developments and trends related to materials for electronic packaging.
No Index | Yes |
---|---|
Podcast | No |
Industries | Chemicals and Materials |
WIP Number | D139-01-00-00-00 |
Is Prebook | No |